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A Reflow Oven is designed to be used primarily for reflow soldering purposes and applications of surface mount electronic components to PCB. This oven is developed with numerous zones that are individually controlled for setting the desired temperature. These several heating zones are also followed by cooling sections. In addition to this, the oven has a sturdy and durable conveyor belt to ensure safe and swift passage of PCB through the oven. The PCB is subjected to a restricted time-temperature profile. In addition to this, some ovens have features to reflow PCBs in an atmosphere having no oxygen as they use Nitrogen (N2) for this purpose. It is designed to ensure high productivity with its outstanding process control and automation designs. It can be easily used for semiconductor packaging, printed circuit board assembly, LED assemblies, etc.
Features of Reflow Oven: