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Reflow Oven

A Reflow Oven is designed to be used primarily for reflow soldering purposes and applications of surface mount electronic components to PCB. This oven is developed with numerous zones that are individually controlled for setting the desired temperature. These several heating zones are also followed by cooling sections. In addition to this, the oven has a sturdy and durable conveyor belt to ensure safe and swift passage of PCB through the oven. The PCB is subjected to a restricted time-temperature profile. In addition to this, some ovens have features to reflow PCBs in an atmosphere having no oxygen as they use Nitrogen (N2) for this purpose. It is designed to ensure high productivity with its outstanding process control and automation designs. It can be easily used for semiconductor packaging, printed circuit board assembly, LED assemblies, etc.

Features of Reflow Oven:

  • Ideally designed to minimize total cost of ownership and maintenance

  • Innovative software to automatically lower the power and gas consumption when the machine is not working

  • Ready time for recovering and reaching high-stability in the process stability

  • Dual chamber, record timing option and swift recipe changeover time

No.46 Datian Road, Buchong Market, Shajing Town, Bao'An District, Shenzhen - 518000, Guangdong, China
Ms. Lisa Lau (Overseas Manager)
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